System and method for noise reduction in multi-layer ceramic packages
US7348667B2 · kind B2 · utility
12Cited by
2References
20Claims
0Family size
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Key dates
| Filing date | Mar 22, 2005 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | May 27, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system and method for reducing noise in a multi-layer ceramic package are provided. With the system and method, additional shielding wires are inserted into the reference planes wherever there are no signal vias present. These additional lines in the reference planes force stronger signal interaction with the reference (vdd/gnd) thereby reducing the interaction between the signals in the signal layers. As a result, the noise present in the signals of the signal layers is reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.