Inventor · Milpitas, CA, US

Brian Lynch

11Patents
7h-index
8Co-inventors
59Inventor score

Filing activity: Mar 27, 1975 → Dec 30, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US5466635A Process for making an interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating Emerging Cross-Sectional Technologies 110 Expired
US5872404A Interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating Emerging Cross-Sectional Technologies 38 Expired
US5698465A Process for manufacturing an interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating Emerging Cross-Sectional Technologies 31 Expired
US5763952A Multi-layer tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same Emerging Cross-Sectional Technologies 25 Expired
US5681777A Process for manufacturing a multi-layer tab tape semiconductor device Emerging Cross-Sectional Technologies 23 Expired
US6171888A Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same Electricity 19 Expired
US3983303A Method of manufacturing articles from metal coated with a zirconium nitride layer Emerging Cross-Sectional Technologies 10 Expired
US5482897A Integrated circuit with on-chip ground plane Emerging Cross-Sectional Technologies 7 Expired
US5447229A Cot/tab protective shipping apparatus and method Emerging Cross-Sectional Technologies 5 Expired
US5892272A Integrated circuit with on-chip ground base Emerging Cross-Sectional Technologies 4 Expired
US11659311B2 Sound port adapter for microphone assembly Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.