Integrated circuit with on-chip ground plane
US5482897A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 19, 1994 |
| Grant date | Jan 9, 1996 |
| Priority date | — |
| Expiry date | Jul 19, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit includes a ground plane structure which provides a uniform ground potential throughout the integrated circuit and improves its performance. The ground plane structure is carried atop the active circuit elements of the integrated circuit and connects with each of the ground-potential contact pads of the circuit. A method of making the integrated circuit includes applying a ground plane precursor structure over all of the integrated circuit topology, and removing portions of the precursor structure where the ground plane is not desired. A method of providing bump structures at each of the contact pads for use in TAB bonding of the electrical connections of the integrated circuit to a package structure is also set forth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.