Bryan McChesney
1Patents
0h-index
2Co-inventors
16Inventor score
Filing activity: Apr 20, 2016 → Apr 20, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9711459B2 | Multi-layer substrate with an embedded die | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.