Byeonggyu HWANG
3Patents
1h-index
17Co-inventors
37Inventor score
Filing activity: Mar 4, 2016 → May 15, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10106687B2 | Composition for forming silica layer, method for manufacturing silica layer and silica layer | Chemistry; Metallurgy | 1 | Active |
| US10804095B2 | Composition for forming silica layer, silica layer, and electronic device | Electricity | 0 | Active |
| US11201052B2 | Composition for forming silica layer, silica layer and electronic device incorporating silica layer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.