Composition for forming silica layer, method for manufacturing silica layer and silica layer
US10106687B2 · kind B2 · utility
1Cited by
18References
12Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 4, 2016 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Mar 4, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D183/16
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A composition for forming a silica layer includes a silicon-containing polymer and a mixed solvent including at least two solvents, wherein the mixed solvent has a surface tension of about 5 mN/m to about 35 mN/m at a temperature of about 25° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.