C. W. Hsiao
1Patents
1h-index
6Co-inventors
25Inventor score
Filing activity: Feb 5, 2010 → Feb 5, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8426256B2 | Method of forming stacked-die packages | Electricity | 19 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.