Caesar Lin
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: May 11, 2001 → May 11, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6610560B2 | Chip-on-chip based multi-chip module with molded underfill and method of fabricating the same | Electricity | 22 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.