Carolyn Block
4Patents
4h-index
8Co-inventors
36Inventor score
Filing activity: Dec 18, 2000 → Jun 2, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6800554B2 | Copper alloys for interconnections having improved electromigration characteristics and methods of making same | Electricity | 24 | Expired |
| US7220674B2 | Copper alloys for interconnections having improved electromigration characteristics and methods of making same | Electricity | 13 | Expired |
| US6977220B2 | Copper alloys for interconnections having improved electromigration characteristics and methods of making same | Electricity | 8 | Expired |
| US6794755B2 | Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement | Electricity | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.