Cecile Berne
4Patents
3h-index
9Co-inventors
36Inventor score
Filing activity: Oct 7, 2003 → Jan 30, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7406994B2 | Substrate layer cutting device and method | Emerging Cross-Sectional Technologies | 8 | Active |
| US6936523B2 | Two-stage annealing method for manufacturing semiconductor substrates | Electricity | 7 | Expired |
| US7189304B2 | Substrate layer cutting device and method | Emerging Cross-Sectional Technologies | 5 | Expired |
| US9029127B2 | Method of degrading TBP using a photosynthetic bacterial strain | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.