Chad C Schmidt
2Patents
2h-index
6Co-inventors
30Inventor score
Filing activity: Mar 31, 2009 → Jun 1, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8564955B2 | Coupling heat sink to integrated circuit chip with thermal interface material | Emerging Cross-Sectional Technologies | 24 | Active |
| US7961469B2 | Method and apparatus for distributing a thermal interface material | Emerging Cross-Sectional Technologies | 7 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.