Coupling heat sink to integrated circuit chip with thermal interface material
US8564955B2 · kind B2 · utility
24Cited by
58References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2011 |
| Grant date | Oct 22, 2013 |
| Priority date | — |
| Expiry date | Nov 18, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.