Chaunbin Pan
1Patents
1h-index
3Co-inventors
25Inventor score
Filing activity: Mar 31, 1997 → Mar 31, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5935868A | Interconnect structure and method to achieve unlanded vias for low dielectric constant materials | Electricity | 54 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.