Chee Chiew Chong
1Patents
0h-index
4Co-inventors
19Inventor score
Filing activity: Jun 19, 2020 → Jun 19, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11239127B2 | Topside-cooled semiconductor package with molded standoff | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.