Chee Hoo Lee
3Patents
3h-index
3Co-inventors
36Inventor score
Filing activity: Jun 30, 2004 → Oct 30, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7081800B2 | Package integrated one-quarter wavelength and three-quarter wavelength balun | Electricity | 12 | Expired |
| US7341887B2 | Integrated circuit die configuration for packaging | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7714427B2 | Integrated circuit die configuration for packaging | Emerging Cross-Sectional Technologies | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.