Cheng Tan
3Patents
2h-index
16Co-inventors
41Inventor score
Filing activity: Jun 9, 2003 → May 28, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7989338B2 | Grain boundary blocking for stress migration and electromigration improvement in CU interconnects | Electricity | 6 | Active |
| US6878623B2 | Technique to achieve thick silicide film for ultra-shallow junctions | Electricity | 3 | Expired |
| US11929488B2 | AB5-based hydrogen storage alloy, electrode for Ni-MH battery, secondary battery, and preparation method of hydrogen storage alloy | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.