Cheng Wang
4Patents
1h-index
17Co-inventors
45Inventor score
Filing activity: Jan 7, 2000 → Sep 26, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6651198B1 | System and method for testing on-chip modules and the interconnections between on-chip modules | Physics | 7 | Expired |
| US10502359B2 | Carrying device | Mechanical Engineering; Lighting; Heating | 1 | Active |
| US12418247B2 | Modulation method for direct current (DC) coupling converter with less dc voltage sensors | Electricity | 0 | Active |
| US9676020B2 | Trough-form fine blanking device | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.