Chengzi YANG
1Patents
0h-index
6Co-inventors
19Inventor score
Filing activity: May 22, 2020 → May 22, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11158609B2 | Three-dimensional integrated package device for high-voltage silicon carbide power module | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.