CHENYE HE
1Patents
0h-index
3Co-inventors
19Inventor score
Filing activity: Nov 20, 2021 → Nov 20, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11854949B2 | Package structure having a plurality of chips attached to a lead frame by redistribution layer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.