Chew B. Chan
3Patents
1h-index
8Co-inventors
33Inventor score
Filing activity: Oct 24, 2006 → Apr 4, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8075721B2 | Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability | Emerging Cross-Sectional Technologies | 2 | Active |
| US8648460B2 | Thermal interface material with epoxidized nutshell oil | Electricity | 0 | Active |
| US8273606B2 | Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.