Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process
US8273606B2 · kind B2 · utility
0Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2010 |
| Grant date | Sep 25, 2012 |
| Priority date | — |
| Expiry date | Oct 16, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method of fabricating a semiconductor package or circuit assembly using an fluxing underfill composition applied to solder contact points in a dip process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.