Chew Weng Leong
3Patents
3h-index
6Co-inventors
36Inventor score
Filing activity: Sep 1, 1998 → Mar 16, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6091140A | Thin chip-size integrated circuit package | Electricity | 71 | Expired |
| US6468831B2 | Method of fabricating thin integrated circuit units | Electricity | 33 | Expired |
| US6274929A | Stacked double sided integrated circuit package | Electricity | 22 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.