Chi Cheng Pan
2Patents
2h-index
9Co-inventors
30Inventor score
Filing activity: Mar 12, 2003 → Jul 29, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6768332B2 | Semiconductor wafer and testing method for the same | Physics | 9 | Expired |
| US7012334B2 | Semiconductor chip with bumps and method for manufacturing the same | Electricity | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.