Semiconductor wafer and testing method for the same
US6768332B2 · kind B2 · utility
9Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2003 |
| Grant date | Jul 27, 2004 |
| Priority date | — |
| Expiry date | Mar 12, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2884
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor wafer includes a plurality of areas and an array of dice disposed within each of the areas. The feature of the present invention is that at least two fiducial marks are disposed in each of the areas. The present invention further provides a method of testing a sawed semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.