Chi-Mon Chen
2Patents
0h-index
6Co-inventors
24Inventor score
Filing activity: Dec 22, 2014 → Sep 26, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9788416B2 | Multilayer substrate for semiconductor packaging | Electricity | 0 | Active |
| US10916486B2 | Semiconductor device including silane based adhesion promoter and method of making | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.