CHI PAN
1Patents
1h-index
8Co-inventors
25Inventor score
Filing activity: Jun 9, 2017 → Jun 9, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10217649B2 | Semiconductor device package having an underfill barrier | Electricity | 6 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.