Chih-Yang Chan
2Patents
1h-index
13Co-inventors
41Inventor score
Filing activity: Nov 16, 2004 → Feb 17, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7459386B2 | Method for forming solder bumps of increased height | Electricity | 10 | Expired |
| US9761468B2 | Device and method for wafer taping | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.