Device and method for wafer taping
US9761468B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2014 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Dec 4, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1705
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In accordance with some embodiments, a wafer taping device is provided. The wafer taping device includes a tape delivering along a first direction. The wafer taping device also includes a wafer mount unit disposed below the tape. The wafer mount unit has an upper surface for supporting a wafer and having a notch for allowing a cut mark of the wafer to align with it. The notch is staggered with a second direction in the upper surface, and the second direction is substantially perpendicular to the first direction. In addition, the wafer taping device includes a laminating roller disposed above the wafer mount unit and having a long axis elongated in the second direction. The laminating roller is configured to reciprocate along the first direction for pressing the tape to the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.