Chikai Tanaka
5Patents
2h-index
5Co-inventors
33Inventor score
Filing activity: Mar 1, 1999 → Mar 18, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6360687B1 | Wafer flattening system | Electricity | 23 | Expired |
| US6254718A | Combined CMP and plasma etching wafer flattening system | Electricity | 3 | Expired |
| US6302995A | Local etching apparatus | Electricity | 2 | Expired |
| US6451217B1 | Wafer etching method | Electricity | 1 | Expired |
| US7005032B2 | Wafer table for local dry etching apparatus | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.