Ching-Shui CHENG
2Patents
1h-index
10Co-inventors
31Inventor score
Filing activity: Jan 23, 2001 → Nov 21, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6737720B2 | Packaging structure of image sensor and method for packaging the same | Electricity | 10 | Expired |
| US6501187B1 | Semiconductor package structure having central leads and method for packaging the same | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.