Ching-Wei Hung
2Patents
1h-index
3Co-inventors
30Inventor score
Filing activity: Mar 20, 2008 → Nov 4, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7884472B2 | Semiconductor package having substrate ID code and its fabricating method | Electricity | 9 | Active |
| US8159063B2 | Substrate and package with micro BGA configuration | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.