Substrate and package with micro BGA configuration
US8159063B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 4, 2009 |
| Grant date | Apr 17, 2012 |
| Priority date | — |
| Expiry date | Dec 10, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate of a micro-BGA package is revealed, primarily comprising a substrate core, a first trace, and a second trace where the substrate core has a slot formed between a first board part and a second board part. The first trace is disposed on the first board part and has a suspended inner lead extended into the slot where the inner lead has an assumed broken point. The second trace is disposed on the second board part and is integrally connected to the inner lead at the assumed broken point. More particularly, a non-circular through hole is formed at the assumed broken point and has two symmetric V-notches away from each other and facing toward two opposing external sides of the inner lead so that the inner lead at two opposing external sides does not have the conventional V-notches cutting into the inner lead from outside. Moreover, the inner lead will not unexpectedly be broken and the inner lead can easily and accurately be broken at the assumed broken point during thermal compression processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.