Chong Ser Choong
4Patents
4h-index
1Co-inventors
33Inventor score
Filing activity: Oct 5, 2007 → Nov 8, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8178936B2 | Double-side mountable MEMS package | Electricity | 38 | Active |
| US7843021B2 | Double-side mountable MEMS package | Electricity | 18 | Active |
| US8045733B2 | Silicon microphone with enhanced impact proof structure using bonding wires | Electricity | 18 | Active |
| US8013404B2 | Folded lead-frame packages for MEMS devices | Electricity | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.