Christoph Liebl
1Patents
0h-index
5Co-inventors
19Inventor score
Filing activity: Dec 13, 2018 → Dec 13, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10978378B2 | Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.