Patent · US Active

Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier

US10978378B2 · kind B2 · utility

0Cited by

3References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Bemmerl · Schwandorf, DE
Kuok Wai Chan · Melaka City, MY
Christoph Liebl · Munich, DE
Bun Kian Tay · Melaka City, MY
Wee Boon Tay · Melaka City, MY
Wae Chet Yong · Melaka City, MY

Key dates

Filing date	Dec 13, 2018
Grant date	Apr 13, 2021
Priority date	—
Expiry date	Dec 13, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1815
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A leadless package includes an at least partially electrically conductive carrier having a mounting section and a lead section, an electronic chip mounted on the mounting section, and an encapsulant at least partially encapsulating the electronic chip and partially encapsulating the carrier so that at least part of an interior sidewall of the lead section not forming part of an exterior sidewall of the package is exposed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.