Inventor · Belmont, CA, US

Christopher R. Hauf

23Patents
6h-index
12Co-inventors
62Inventor score

Filing activity: Oct 24, 2008 → Feb 7, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US9010899B2 Techniques for print ink volume control to deposit fluids within precise tolerances Electricity 44 Active
US9832428B2 Fast measurement of droplet parameters in industrial printing system Physics 24 Active
US9352561B2 Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances Performing Operations; Transporting 23 Active
US9224952B2 Methods of manufacturing electronic display devices employing nozzle-droplet combination techniques to deposit fluids in substrate locations within precise tolerances Electricity 22 Active
US9802403B2 Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances Performing Operations; Transporting 20 Active
US9537119B2 Nozzle-droplet combination techniques to deposit fluids in substrate locations within precise tolerances Electricity 19 Active
US8085435B2 Adaptive color transform to control color inconstancy Electricity 4 Active
US11135835B2 Ejection control using substrate alignment features and print region alignment features Performing Operations; Transporting 3 Active
US10784470B2 Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances Electricity 2 Active
US11489146B2 Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances Electricity 2 Active
US11628666B2 Ejection control using substrate alignment features and print region alignment features Performing Operations; Transporting 2 Active
US11233226B2 Nozzle-droplet combination techniques to deposit fluids in substrate locations within precise tolerances Electricity 1 Active
US10950826B2 Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances Electricity 1 Active
US10797270B2 Nozzle-droplet combination techniques to deposit fluids in substrate locations within precise tolerances Electricity 1 Active
US11945219B2 Ejection control using substrate alignment features and print region alignment features Performing Operations; Transporting 1 Active
US10784472B2 Nozzle-droplet combination techniques to deposit fluids in substrate locations within precise tolerances Electricity 1 Active
US11678561B2 Nozzle-droplet combination techniques to deposit fluids in substrate locations within precise tolerances Electricity 0 Active
US11203207B2 Techniques for manufacturing thin films with improved homogeneity and print speed Emerging Cross-Sectional Technologies 0 Active
US11135854B2 Ejection control using imager Electricity 0 Active
US12059910B2 Techniques for manufacturing thin films with improved homogeneity and print speed Emerging Cross-Sectional Technologies 0 Active
US11801687B2 Ejection control using imager Electricity 0 Active
US12370790B2 Ejection control using substrate alignment features and print region alignment features Performing Operations; Transporting 0 Active
US12256626B2 Nozzle-droplet combination techniques to deposit fluids in substrate locations within precise tolerances Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.