Ejection control using substrate alignment features and print region alignment features
US11135835B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2019 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | Dec 16, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/04586
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
In a printing method, at least one image of a substrate supported in a printing system is acquired. An actual position of a first alignment feature on the substrate in a frame of reference of the printing system is determined based on the at least one image. Expected positions of second alignment features on the substrate are determined based on the actual position of the first alignment feature. Actual positions of the second alignment features in the frame of reference of the printing system are determined based on the at least one image and the expected positions of the second alignment features. Target positions of print regions on the substrate are determined based on the actual positions of the second alignment features. Ejection of print material onto the substrate in the print regions is controlled based on the target positions of the print regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.