Congge Lu
1Patents
0h-index
6Co-inventors
19Inventor score
Filing activity: Mar 1, 2021 → Mar 1, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11791232B2 | Packaging structure and packaging method of digital circuit | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.