Da-Hye Min
1Patents
0h-index
6Co-inventors
19Inventor score
Filing activity: Sep 20, 2017 → Sep 20, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10347576B2 | Package substrate and semiconductor package including the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.