Da Un NAH
4Patents
1h-index
8Co-inventors
30Inventor score
Filing activity: Dec 28, 2009 → Dec 29, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8525319B2 | Selecting chips within a stacked semiconductor package using through-electrodes | Electricity | 1 | Active |
| US8624375B2 | Semiconductor package for selecting semiconductor chip from a chip stack | Electricity | 1 | Active |
| US8242582B2 | Semiconductor package and stacked semiconductor package having the same | Electricity | 0 | Active |
| US8304879B2 | Spiral staircase shaped stacked semiconductor package and method for manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.