Daishi Tanabe
2Patents
1h-index
5Co-inventors
37Inventor score
Filing activity: Dec 20, 2011 → Mar 25, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8421215B2 | Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board | Electricity | 10 | Active |
| US12174051B2 | Electrode embedded ceramic structure | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.