Daisuke Oka
7Patents
2h-index
13Co-inventors
44Inventor score
Filing activity: Oct 31, 2007 → Feb 15, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8652941B2 | Wafer dicing employing edge region underfill removal | Electricity | 6 | Active |
| US8008410B2 | Epoxy resin composition for encapsulating semiconductor and semiconductor device | Electricity | 2 | Active |
| US11332911B2 | Construction machine | Mechanical Engineering; Lighting; Heating | 2 | Active |
| US10676897B2 | Construction machine | Mechanical Engineering; Lighting; Heating | 1 | Active |
| US10995473B2 | Construction machine | Mechanical Engineering; Lighting; Heating | 1 | Active |
| US11280059B2 | Hydraulic drive system for construction machine | Fixed Constructions | 1 | Active |
| US11111650B2 | Hydraulic drive system for construction machine | Mechanical Engineering; Lighting; Heating | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.