Daisuke Urayama
3Patents
1h-index
10Co-inventors
37Inventor score
Filing activity: Apr 22, 2013 → Sep 11, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9660182B2 | Plasma processing method and plasma processing apparatus | Electricity | 4 | Active |
| US10923329B2 | Substrate processing apparatus and substrate processing method | Electricity | 0 | Active |
| US10825688B2 | Method for etching copper layer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.