Daniel E. Stasiw
2Patents
0h-index
4Co-inventors
21Inventor score
Filing activity: Nov 21, 2019 → Apr 24, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11837684B2 | Submount structures for light emitting diode packages | Electricity | 0 | Active |
| US11508715B2 | Light-emitting diode chip with electrical overstress protection | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.