Daniel Mark Dinneen
8Patents
4h-index
12Co-inventors
50Inventor score
Filing activity: Aug 9, 2005 → Jul 30, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7690324B1 | Small-volume electroless plating cell | Electricity | 13 | Active |
| US9822460B2 | Methods and apparatuses for electroplating and seed layer detection | Electricity | 7 | Active |
| US10196753B2 | Methods and apparatuses for electroplating and seed layer detection | Electricity | 5 | Active |
| US9809898B2 | Electroplating and post-electrofill systems with integrated process edge imaging and metrology systems | Electricity | 4 | Active |
| US10407794B2 | Methods and apparatuses for electroplating and seed layer detection | Electricity | 2 | Active |
| US9945044B2 | Method for uniform flow behavior in an electroplating cell | Electricity | 2 | Active |
| US10669644B2 | Methods and apparatuses for electroplating and seed layer detection | Electricity | 0 | Active |
| US10711364B2 | Uniform flow behavior in an electroplating cell | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.