Uniform flow behavior in an electroplating cell
US10711364B2 · kind B2 · utility
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16References
22Claims
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Key dates
| Filing date | Mar 16, 2018 |
| Grant date | Jul 14, 2020 |
| Priority date | — |
| Expiry date | Jan 5, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6723
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatuses and methods are provided for depositing a metal layer on a wafer. A secondary weir is positioned at a region below the primary weir such that overflowed plating solution over the primary weir during electroplating flows in a substantially azimuthally uniform manner. Methods are provided for electroplating wafers by increasing flow rate between wafer processes while plating solution flows over a primary weir, remains in contact with the overflowing plating solution, and flows onto the secondary weir such that overflow is substantially azimuthally uniform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.