Daniel Mermin
1Patents
0h-index
4Co-inventors
19Inventor score
Filing activity: Mar 1, 2019 → Mar 1, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11309269B2 | Method for producing a solder bump on a substrate surface | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.