Method for producing a solder bump on a substrate surface
US11309269B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Mar 1, 2019 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | Mar 1, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73204
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A serigraphy method for producing a soulder bump on the front surface of a substrate includes: forming a film on the front surface, forming an opening in the film, filling the opening with a souldering material, and removing the film. Forming a film on the front surface is preceded by the formation of an intermediate layer between the film and the front surface, the intermediate layer being adapted to exhibit a force of adherence at one and/or the other interface formed with the first front surface and the film lower than the force of adherence that can be formed between the film and the first front surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.