Daniel Obermeier
1Patents
0h-index
3Co-inventors
19Inventor score
Filing activity: Jun 10, 2020 → Jun 10, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11410906B2 | Semiconductor package and method for fabricating a semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.