Patent · US Active

Semiconductor package and method for fabricating a semiconductor package

US11410906B2 · kind B2 · utility

0Cited by

0References

16Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Juergen Hoegerl · Regensburg, DE
Bernd Betz · Neutraubling, DE
Stephan Bradl · Regensburg, DE
Daniel Obermeier · Ensdorf, DE

Key dates

Filing date	Jun 10, 2020
Grant date	Aug 9, 2022
Priority date	—
Expiry date	Jun 10, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1431
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package for double sided cooling includes a first and a second carrier facing each other, at least one power semiconductor chip arranged between the first and second carriers, external contacts arranged at least partially between the first and second carriers, and spring elements arranged between the first and second carriers and configured to keep the first and second carriers at a predefined distance from each other.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.